Intrinsic stress in ZrN thin films: Evaluation of grain boundary contribution from in situ wafer curvature and ex situ x-ray diffraction techniques

Citation:

Koutsokeras LE, Abadias G. Intrinsic stress in ZrN thin films: Evaluation of grain boundary contribution from in situ wafer curvature and ex situ x-ray diffraction techniques. Journal of Applied Physics [Internet]. 2012;111(9).

Notes:

Cited By :33Export Date: 27 April 2023

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